SMD elements expanding a greater thickness and parts on the motherboard. The PCB stencil soldering procedure does not influence making use of a soldering wave, even in a reflow oven or making use of vapor phase soldering. The possible tin solder is loosened up in the form of a paste using a stencil and also squeegee. The parts are after that noted on the solder paste. The sticky pressure of the paste avoids it from diminishing. Larger parts are typically Glued to it.

SMD Assembly MOKO Printed Circuit Board Assembly Offers thorough solutions for putting together surface-mounted (SMD) parts and also parts for push-through setting up (THT). Our production center is technologically flexible, we tackle the setting up of numerous components from the SMD elements of dimension 0201 to the integrated circuits with QFP and also BGA & uBGA real estates in outstanding top quality with a lot of experience. Our regular collection dimension is in between 1 and also 1000 items, the regular order duration is 5 to 10 days.